Description
The high-density, ceramic-based thermal compound is specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Ceramique 2 uses ceramic fillers so it is neither electrically conductive nor capacitive. The tri-linear composite of aluminum oxide, zinc oxide and boron nitride allows the thinnest possible bond line with modern processors, heatsinks and electronics. Critically-sized particles and ultra-high shear mixing techniques maximize Ceramique 2's thermal performance and help maintain a stable homogenous suspension. This exclusive combination provides performance exceeding most metal based compounds.